High accuracy mask movement.
Mask aligner precision optical alignment system.
Non-contact mask aligner system.
Mask aligner applicable to wafers up to 6 inches in diameter.
"For Research and Development, Multiproduct Production Field".
"Cutting Edge of Technology".
Adoption of fully non-contact calibration system.
No damage to mask and wafer in calibration.
Significant improvement in gap accuracy.
Interactive operation on PC monitor is adopted.
High precision alignment based on "assist lines" is possible.
SMA-600M is a manual mask aligner for R&D and multiproduct production field, which adopts a clear optical system and fully non-contact calibration unit. The exposure up to 150mm wafer is capable by contact or proximity mode. It is the most suitable system in exposure process for various kinds of electronic devices such compound semiconductors as LD, LED, and manufacturing process for micromachines including pressure sensor and the like.
- Economical, Compact & Hi-Level Performance mask aligner
- Viewing fused image of two alignment marks in the field of view.
- Integrator lens for exposure.
- LED illuminator
(Micromachine development in R&D center and university)
- Acuator, Pressure Sensor, Acceleration Sensor, Power Device, etc.
- Exposure for Flip Chip/BGA/CSP.
- Exposure for Optical/High Speed Communication Components.
Mask aligner specification
|Objectives separation||15 ~ 75mm|
|Illuminator for observation||Red LED (l=633 nm)|
|X, Y Movement range of stage||±5 mm|
|Power source for main body and mercury lamp||AC 100V 50/60Hz 15A|
|Vacuum source||Below 21.3 Kpa (-80 Kpa from atmospheric pressure)|
|Mercury lamp||250W ultra-high pressure vapor mercury lamp|
|Effective exposure area||Max 100 mm|
|Intensity distribution||±5% or less|
|Intensity of illumination||20 mW/cm2 (405 nm)|
|Exposure time control||Digital timer and rotary solenoid|
|Mercury Lamp Lighting Unit||AC 110V|
(applicable to wafers up to 4 inches in diameter)
(applicable to wafers up to 6 inches in diameter)
(applicable to wafers up to 8 inches in diameter)
The MPEM series is a high precision double-view mask aligner including alignment optical systems on the top and bottom sides of a wafer, so that contact, soft-contact, and proximity patterning can be performed to the top side surface, in alignment with the pattern on the bottom side of the wafer. The accurate alignment of the mask and wafer was made possibly by the high- resolution optical system with the symmetrically arranged 10X objective lenses installed on the top and bottom sides. As the separation between the paired objective lenses can be adjusted, irregularly formed wafers can also be aligned freely.
* Besides the above, Motorized type MPEM-2000/4000 and Full Auto type MPEM-8M/12M are available.
Mask aligner specification
|Photomask size||5-inches maximum||7-inches maximum||9-inches maximum|
|Wafer size||up to 4-inches (Amorphous)||up to 6-inches (Amorphous)||up to 8-inches (Amorphous)|
|Mask holder sliding||Manual chuck|
|Mask movement||X=±3 mm, Y=±3 mm|
|Exposure||Method||Soft contact / Hard contact / Proximity exposures|
|Illumination||250W ultra-high-pressure vapor mercury lamp||500W ultra-high-pressure vapor mercury lamp|
|Effective exposure area||O 100 mm in diamete||O 150 mm in diamete||O 200 mm in diamete|
|Alignment||Method||Viewing by eyepieces (Sprit field system)||9-inch TV monitor system|
|Objective lenses||10X two pairs (upper/lower)|
|Eyepieces||NWF 10X (one pair)||-|
|Objective lens separation||15 ~ 90 mm||80 ~ 140 mm||55 ~ 184 mm|
X, Y = ±4mm
? = ±22.5°
X, Y = ±4mm
? = ±5°
|Alignment gap||09 ~ 99µm|
|Alignment accuracy||less than ±5mm|
|Utilities||Power supply for main unit||100-220V AC, 50/60Hz, 15A (600W)|
|Power supply for mercury lamp||100-220V AC, 50/60Hz, 15A (550W)||100-220V AC, 50/60Hz, 15A (1,100W)|
|N2 gas||0.4 ~ 0.5 Mpa||100-220V AC, 50/60Hz, 15A (1,100W)|
less than 21.3kPa
(-80kPa from atmospheric pressure)
|Dimensions (main unit)||
|Net weight||approx. 450 kg||approx. 550 kg||approx. 700 kg|
NWF 15X eyepieces (one pair)
9-inch TV monitor system (black and white)